Introbotix is pleased to announce their membership and participation in High Density Packaging User Group to help shape the future of the printed wiring board industry.

ALBUQUERQUE, NM – Introbotix is pleased to announce their membership and participation in High Density Packaging User Group to help shape the future of the printed wiring board industry. The High Density Packaging User Group (HDPUG) is a collection of electronics industry companies working to develop standardized test methodologies in order to meet the current and future challenges of the industry.

“It has been incredibly valuable for Introbotix to be part of the HDPUG effort,” says Brian Butler, founder of Introbotix. “It exposes us to other companies who are interested in our field of technology and helps define not only our product roadmap but also the roadmap of the industry as a whole.”

Introbotix is currently participating in the Materials Characteristic Committee, the Back Drilling Failure Analysis subcommittee, and the Copper Surface Roughness Committee.

Brian Butler and Introbotix were recently featured on the web series “Real Time with the IPC.” The interview is now online and can be viewed at:

http://realtimewith.com/rtwboot/show.php?id=81&vid=3606

Further information about the HDPUG can be found at:

http://hdpug.org